bad solder joints analysis report for model 103 1, Description of the Problem 103 Boards have bad solder joints on U7 and U8. 2, Short Term Containment Actions a, Full inspect IC 001 raw material which are in the warehouse. b, Full inspect the IC on U7, U8 area. 2, Root Cause of Problems a, IC got bent up or crooked, this IC in two packing way, one is in tray, another is in reel. The pins can be bent during the transportation. b, The IC is small, it has 48 pins, and the distance between 2 pins in very narrow. Our AOI and QC can`t inspect if all the pins have good connection. c, QC missed inspection. 3, Corrective Actions to Be Taken a, Company in the USA will provide ICs in tape and reels, in the meantime until all parts are used that are in trays will be closely inspected by the microscope. b, IQC must full inspect the IC when it comes. c, IPQC must full inspect the IC before production. d, After reflow soldering and AOI, QC must full inspect with a magnifier. e, QA inspect 10pcs samples every hour, and inspect all ICs with microscope. f, suggest customer make the tester to test the IC U7 and U8.